- Product Description
Layer ：4L
Board thickness：1.5mmCopper thickness：1oz
Surface treatment：chemical nickel gold
Line width and space：0.152mil / 0.152mil
Application：Amplifier
Technical application：The product is used in communication power amplifier modules. Both RO4350B and FR-4 laminated mixture. The top metal slot is designed to have a copper-free depth of 0.5mm. The thermal stability of the product is more than three times of ordinary FR-4.