- Product Description
Layer :4L
Board thickness:1.5mmCopper thickness:1oz
Surface treatment:chemical nickel gold
Line width and space:0.152mil / 0.152mil
Application:Amplifier
Technical application:The product is used in communication power amplifier modules. Both RO4350B and FR-4 laminated mixture. The top metal slot is designed to have a copper-free depth of 0.5mm. The thermal stability of the product is more than three times of ordinary FR-4.


