With the advancement of electronic design technology and manufacturing processes,electronic products are gradually developing towards high-density,high-functionality,lightweight,short,and high transmission rates;In addition,with the rapid development of chip miniaturization and the increase in data transmission,the working frequency of the system is also increasing,and the application of high-frequency circuit boards is also becoming more and more widespread.
High frequency circuit board circuit design,structural design,and process technology are the three major elements of electronic product design.To become an excellent electronic product,not only does it require excellent circuit design,but also good manufacturability.Good manufacturability can reduce problems that occur during mass production,shorten product development progress,reduce design costs,and ultimately improve product competitiveness.Therefore,it is particularly important for product design engineers to choose circuit board materials when designing electronic products.
Liu Jianjun,Vice President of Asia Pacific Marketing at Rogers Corporation,believes that"with the development of communication technology from 2G,2.5G to 3G,as well as the current 4G,the data transmission throughput is increasing,and the required bandwidth and frequency are becoming wider and higher.The miniaturization of equipment is also one of the future development trends,and once the equipment becomes smaller,it requires the circuit board to have higher heat conduction capacity and higher dielectric constant,High frequency circuit board materials are mainly used in high-power amplifiers,base station antennas,global positioning systems,weather radars and satellites,as well as automotive radars and sensors.
When the working frequency of the circuit is in the RF frequency band,the range of sheet materials that design engineers can choose will be significantly reduced.Rogers'RO4835 high-frequency circuit board board board has a special formula that improves its oxidation resistance.When used for a long time at a certain temperature,it can provide particularly stable electrical properties while maintaining the same processing advantages as FR4 thermosetting resin materials.At the same time,like RO4350B,the dielectric constant(Dk)at 10GHz is 3.48,the dielectric loss(Df)is 0.0037,and the low Z-axis coefficient of thermal expansion(CTE)ensures the reliability of metal vias under various processing and operating conditions.The X-axis and Y-axis expansion coefficients of this material are similar to those of copper,and it has excellent dimensional stability.
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How to choose high-frequency circuit board materials?
View:3008 Release Date:2023/6/8 19:14:32

